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HT82V739 1200mW Audio Power Amp with Shutdown
Features
* Operating voltage: 2.2V to 5.5V * High signal-to-noise ratio * Low distortion * Large output voltage swing * Low power consumption * Output power 1200mW at 10% THD+N into 8W * Wide temperature operating range * Low power-on and chip enable or disable POP noise. * Low standby current * Power off control * Direct drive speaker * 8-pin DIP/SOP package
(VDD=5V)
Applications
* Applied for HT36 series, HT86 series and other
Holtek products
General Description
HT82V739 is an integrated class AB mono speaker driver contained in a 8-pin DIP/SOP package. The HT82V739 is capable of delivering 1200mW output power to an 8W load with less than 10% (THD+N) from a 5V power supply. The very low standby current in shutdown mode contributes to the reduction of power consumption of battery-powered equipments.
Block Diagram
OUTN A u d In VREF VSS VDD R B IA S CE R 10R R AMP2 AMP1 OUTP
Pin Assignment
OUTN 1 2 3 4 5 6 7 A u d In VREF VSS 8 VDD OUTP NC CE
H T82V739 8 D IP -A /S O P -A
Pin Description
Pin No. 1 2 3 4 5 6 7 8 Pin Name OUTN Aud In VREF VSS CE NC OUTP VDD I/O O I O 3/4 I 3/4 O 3/4 Negative output Audio input Speaker non-inverting input voltage reference Negative power supply, ground Chip enable, low active Not connected Positive output Positive power supply Description
Rev. 1.20
1
January 17, 2008
HT82V739
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V Input Voltage..............................VSS-0.3V to VDD+0.3V Storage Temperature ............................-50C to 125C Operating Temperature...........................-40C to 85C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Electrical Characteristics
Symbol D.C. Characteristics VDD IDD Supply Voltage Quiescent Power Supply Current Shutdown Power Supply Current Input High Voltage for CE Input Low Voltage for CE 3/4 3V 5V 5V VIN=0VP-P, CE=VDD, No load 3/4 3/4 3/4 3/4 RL=4W (THD+N)/S1%, VIN=1kHz sinewave 3V (THD+N)/S10%, VIN=1kHz sinewave PO Output Power (THD+N)/S1%, VIN=1kHz sinewave 5V (THD+N)/S10%, VIN=1kHz sinewave A.C. Characteristics tON Enable Time 3V V =1kHz sinewave, IN 5V No load 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 145 105 0.3 0.18 0.13 66 70 72 RL=8W RL=16W RL=4W RL=8W RL=16W RL=4W RL=8W RL=16W RL=4W RL=8W RL=16W 3/4 VIN=0VP-P, No load 2.2 3/4 3/4 3/4 0.7VDD 0 198 180 144 270 240 168 690 570 390 840 720 480 5.0 2.2 3.5 3/4 3/4 3/4 330 300 240 450 400 280 1150 950 650 1400 1200 800 Parameter Test Conditions VDD Conditions Min. Typ.
VSS=0V, Ta=25C Max. Unit
5.5 4.0 6.0 1 VDD 0.3VDD 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4
V mA mA mA V V
ISD VIH VIL
mW
mW
3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4
ms ms % % % dB dB dB
RL=4W Power output=500mW, Total Harmonic Distortion Plus (THD+N)/S 5V RL=8W VIN=1kHz sinewave Noise-to-signal Ratio RL=16W RL=4W S/N Signal to Noise Ratio VIN=1Vrms 1kHz 5V sinewave RL=8W RL=16W
Rev. 1.20
2
January 17, 2008
HT82V739
Functional Description
OUTP Rising Time (tR) When CE is active low, the HT82V739 needs rising time to output fully on OUTP pin. However, the rising time depends on C1. (*see the application circuits)
CE
OUTP
tR
Capacitor tR Voltage 2.2V 3V 4V 15ms 15ms 15ms 30ms 30ms 30ms 90ms 90ms 90ms 185ms 185ms 185ms 0.1mF 1mF 4.7mF 10mF
For battery based applications, power consumption is a key issue, therefore the amplifier should be turned off when in the standby state. In order to eliminate any speaker sound bursts while turning the amplifier on, the application circuit, which will incorporate a capacitance value of C1, should be adjusted in accordance with the speakers audio frequency response. A greater value of C1 will improve the noise burst while turning on the amplifier. The recommended operation sequence is: Turn On: Aud In signal standby (1/2 VDD) (R) enable amplifier (R) wait tR for amplifier ready (R) Aud In signal start Turn Off: Aud In signal finish (R) disable amplifier (R) wait tR for amplifier off (R) Aud In signal off
A u d In tR CE OUT tR
If the application is not powered by batteries and there is no problem with amplifier On/Off issue, a capacitor value of 0.1mF for C1 is recommended.
Rev. 1.20
3
January 17, 2008
HT82V739
THD+N VS. Output Power
* RLOAD=4W, VIN=1kHz sinewave
%
100 50 20 10 5 2 1 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 1m 2m 5m 10m 20m 50m 100m 200m 500m 1 2 5
THD+N
v s O u tp u t P o w e r
O u tp u t P o w e r (W )
* RLOAD=8W, VIN=1kHz sinewave
%
100 50 20 10 5 2 1 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 1m 2m 5m 10m 20m 50m 100m 200m 500m 1 2 5
THD+N
v s O u tp u t P o w e r
O u tp u t P o w e r (W )
* RLOAD=16W, VIN=1kHz sinewave
%
100 50 20 10 5 2 1 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 1m 2m 5m 10m 20m 50m 100m 200m 500m 1 2 5
THD+N
v s O u tp u t P o w e r
O u tp u t P o w e r (W )
Rev. 1.20
4
January 17, 2008
HT82V739
Application Circuits
A u d io In R 3 C1 1mF CE C3 1mF 2 1 A u d In OUTN V VDD 8 SPK
DD
H T82V739 VREF NC 6 CE 5 OUTP 4 7
C2 47mF
Rev. 1.20
5
January 17, 2008
HT82V739
Package Information
8-pin DIP (300mil) Outline Dimensions
A B 1 8 5 4
H C D E F G
a
I
Symbol A B C D E F G H I a
Dimensions in mil Min. 355 240 125 125 16 50 3/4 295 335 0 Nom. 3/4 3/4 3/4 3/4 3/4 3/4 100 3/4 3/4 3/4 Max. 375 260 135 145 20 70 3/4 315 375 15
Rev. 1.20
6
January 17, 2008
HT82V739
8-pin SOP (150mil) Outline Dimensions
A 1
8
5 B 4
C
C' G D E F
H
a
Symbol A B C C D E F G H a
Dimensions in mil Min. 228 149 14 189 53 3/4 4 22 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 244 157 20 197 69 3/4 10 28 12 10
Rev. 1.20
7
January 17, 2008
HT82V739
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 8N Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 621.5 13.0+0.5 -0.2 2.00.15 12.8+0.3 -0.2 18.20.2
Rev. 1.20
8
January 17, 2008
HT82V739
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P
K0 A0
SOP 8N Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 12.0+0.3 -0.1 8.00.1 1.750.1 5.50.1 1.550.1 1.5+0.25 4.00.1 2.00.1 6.40.1 5.200.1 2.10.1 0.30.05 9.3
Rev. 1.20
9
January 17, 2008
HT82V739
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 86-21-6485-5560 Fax: 86-21-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5/F, Unit A, Productivity Building, Cross of Science M 3rd Road and Gaoxin M 2nd Road, Science Park, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 Fax: 86-10-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 86-28-6653-6590 Fax: 86-28-6653-6591 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com
Copyright O 2008 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.20
10
January 17, 2008

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